Mu Cheng Technology Ltd.
Cleaning Systems
Designed for semiconductor processes and precision parts. Combines ultrasonic, jet airflow, and eco-friendly chemicals to perform multi-stage operations including loading, soaking, ultrasonic cleaning, jet rinsing, high-purity water rinse, and drying. Equipped with PLC and HMI for full-process monitoring, plus remote diagnostics and alarms.
Maintenance supplies: tapes, filter media, cleanroom wiper rolls, and spare consumables—supporting daily upkeep and fast lead times for cleaning processes.
Key Features
- Reduce manual handling time, improve cleaning quality, and lower cost.
- PLC with HMI; graphical screens and easy operation.
- Uses DI water instead of solvents—eco-friendly and reduces fire risk.
- Comprehensive ultrasonic cleaning without easily damaging the workpiece surface.
- Special overflow design to improve cleaning efficiency.
- High-efficiency ultrasonic transducers for stable, consistent cleaning performance.
- Solid-state (MOSFET) driver with automatic frequency sweeping.
- 10" stainless-steel filtration unit with precision media to effectively remove impurities.
- Multiple mechanical safety protections to ensure safe operation.
- Precision linear-rail transfer mechanism with independent lift function.
- High-efficiency hot-air circulation for fast drying and reduced water marks.
- Full SUS304 mirror-finish structure for durability and a clean appearance.
